Cold Gas Plasma:
This process consists of a radio frequency excitation of gaseous products at very low pressure. The temperature of the gas in the vacuum chamber is essentially ambient, so the parts do not heat up.

Cold Gas Plasma can alter the physical and /or chemical reactivity of the surface, while bulk properties remain unaffected. Examples of use are cleaning, etching, and increasing bondability.

By using Cold Gas Plasma, we are able to improve a coating's adhesion to most substrates. It does not affect the substrate material; it does not leave a residue; and it is workplace and environmentally clean and safe.

A diagram of the process is below:

Uses of Gas Plasma Treatment

Cleaning Substrate Change the Wetting Characteristics: Hydrophobic or Hydrophilic Surface Etching Plasma Induced Grafting Polymer Deposition Sterilization