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Parylene is a commercial name for polymers which belong to a unique chemical family: poly-para-Xylylene.
In contrast to conventional coatings, this technique uses gaseous monomers which are polymerized and deposited on substrates as a pinhole-free and stress-free solid film with an outstanding combination of physical, thermal, electrical, barrier and biocompatible properties.
Due to its unique characteristics, poly-Xylylene has been used in many applications that demand a coating with maximum performance and reliability, including biomedical and electronics. Parylene meets USP Class VI and 510(k) requirements for biomedical devices and Mil-I-46085C/IPC-CC-830B specifications for conformal coatings.
Some Applications of Parylene
- Surgical Instruments
- Pacemakers
- Catheters
- Trocars
- Sensors
- Stents
- Biomedical devices
- Forceps
- Needles
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- Fiber Optic Components
- Heat Exchangers
- Hybrids
- Relays
- Power Supplies
- Magnets
- Cores
- Seals
- Capacitors
- PWBs
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- Probes
- Photoelectric Cells
- Elastomers
- Circuit Boards
- Semiconductors
- Metal Components
- Keypads
- Gaskets
- Bobbins
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A diagram of the parylene process:

The following represents a brief list of the main features of poly-p-Xylylene:
- High reliability - Suitable for medical, electronics and military applications
- Particle retention - Upgrades electronic and mechanical devices
- True conformality - Uniform thickness on all surfaces
- Out-gassing - Virtually none
- Light weight - compared to other coatings
- Solvent resistance - Resistant to almost all solvents
- Wide temperature range - From -200 C to +200 C
- Outstanding barrier - Very low permeability to moisture and gases
- Stress-free coatings - Sensitive circuitry unchanged by coating
- Acid and base resistance - Resists attack from exposure
- Radiation resistance - Suitable for sterilization & space applications
- Fungus and bacteria resistance - Excellent
- Low coefficient of friction - Very good lubricity
- Dielectric properties - Extremely high dielectric strength
- Transparency - thin films are of optical clarity
- Mechanical - High tensile and yield strength
| MAIN PROPERTIES of PARYLENE |
| TYPICAL FILM PROPERTIES |
Parylene N |
Parylene C |
Parylene D |
| Physical & Mechanical Properties |
| Tensile strength, psi |
6,500 |
10,000 |
11,000 |
| Tensile strength, Mpa |
45 |
69 |
76 |
| Yield strength, psi |
6,300 |
8,000 |
9,000 |
| Yield strength, Mpa |
43 |
55 |
62 |
| Tensile modulus, Mpa |
2,400 |
3,200 |
2,800 |
| Elongation to break, % |
40 |
200 |
10 |
| Density, g/cm2 |
1.110 |
1.289 |
1.418 |
| Coefficient of friction:
static |
0.25 |
0.29 |
0.33 |
| Coefficient of friction:
dynamic |
0.25 |
0.29 |
0.31 |
| Water absorption, % (24 hr) |
0.01 |
0.06 |
NA |
| Index of refraction, Nd23 |
1.661 |
1.639 |
1.669 |
| Typical Electrical Properties |
| Dielectric strength, (Volts/mil at 1 mil) |
7,000 |
5,800 |
5,500 |
| Volume resistivity, 23 C, 50% RH (Ohm-cm) |
1 x 10 17 |
6 x 10 16 |
2 x 10 16 |
| Surface resistivity, 23 C, 50% RH (Ohms) |
10 13 |
10 14 |
10 15 |
| Dielectric constant at 60 Hz |
2.65 |
3.15 |
2.84 |
| Dielectric constant at 1,000 Hz |
2.65 |
3.1 |
2.82 |
| Dielectric constant at 1,000,000 Hz |
2.65 |
2.95 |
2.8 |
| Dissipation factor at 60 Hz |
0.0002 |
0.02 |
0.004 |
| Dissipation factor at 1,000 Hz |
0.0002 |
0.019 |
0.003 |
| Dissipation factor at 1,000,000 Hz |
0.0006 |
0.013 |
0.002 |
| Typical Barrier Properties |
| Gas Permeability,cc/24 hrs. |
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| Nitrogen |
15 |
0.6 |
4.5 |
| Oxygen |
55 |
5 |
32 |
| Carbon dioxide |
420 |
14 |
13 |
| Hydrogen sulfide |
795 |
13 |
1.45 |
| Sulphur dioxide |
1.89 |
11 |
4.75 |
| Chlorine |
74 |
0.35 |
0.55 |
| Moisture Vapor Transmission,gmil/24hrs |
1.6 |
0.2 |
0.25 |
| Typical Thermal Properties |
| Melting temperature (degrees C) |
410 |
290 |
380 |
| Linear coefficient of expansion, |
6.9 |
3.5 |
NA |
| (10 to the -5th/C) |
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| Thermal conductivity, |
3 |
2 |
NA |
| (10 to the -4th (cal/sec)/(sq cm/cm) |
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Parylene has many uses including medical instrument coating and coating electronics.
For more information on the uses of parylene, log into the technical papers area.
Please contact us to discuss your requirements.
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